From July 6 to 8, 2026, Wang Hongbo, Chairman of CIPS Co., Ltd., led a delegation to Hong Kong to attend the Hong Kong Monetary and Fixed Income Summit. During the visit, the delegation conducted business exchanges and market development activities with local financial institutions on topics including the cross-border use of the RMB and CIPS business development.

On July 7, 2026, Wang Hongbo, Chairman of CIPS Co., Ltd., and Bonnie Chan, Group Chief Executive Officer of Hong Kong Exchanges and Clearing Limited, signed a memorandum of cooperation in Hong Kong. The signing was witnessed by Pan Gongsheng, Governor of the People's Bank of China, and John Lee, Chief Executive of the Hong Kong Special Administrative Region.

Chairman Wang and his delegation also held in-depth discussions with CMU, the Bank of East Asia, Bank of China (Hong Kong), HSBC Hong Kong and Standard Chartered Hong Kong. Chairman Wang stated that CIPS Co., Ltd. would continue to enhance system functionality, expand its global network and strengthen its international competitiveness, with the aim of developing a more efficient, secure, inclusive and diversified cross-border payment system.